XQVR1000-4CG560M vs 5962R9957401QXA feature comparison

XQVR1000-4CG560M AMD Xilinx

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5962R9957401QXA AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code CGA BGA
Package Description HEAT SINK, CERAMIC, CGA-560 BGA, CGA560,33X33,50
Pin Count 560 560
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-CBGA-X560 S-CBGA-B560
Length 42.5 mm 42.5 mm
Number of CLBs 6144
Number of Equivalent Gates 1124022 1124022
Number of Inputs 404 404
Number of Logic Cells 27648 27648
Number of Outputs 404 404
Number of Terminals 560 560
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 6144 CLBS, 1124022 GATES 1124022 GATES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code HCGA BGA
Package Equivalence Code CGA560,33X33,50 CGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.9 mm 5.35 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form UNSPECIFIED BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Total Dose 100k Rad(Si) V 100k Rad(Si) V
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
JESD-609 Code e0
Screening Level MIL-PRF-38535 Class Q
Terminal Finish TIN LEAD

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