XQ6VLX130T-1FFG1156E
vs
XQ6VLX130T-1FFG1156C
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-609 Code |
e1
|
e1
|
Moisture Sensitivity Level |
4
|
4
|
Peak Reflow Temperature (Cel) |
245
|
245
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
2
|
2
|
Package Description |
|
35 X 35 MM, LEAD FREE, FBGA-1156
|
Combinatorial Delay of a CLB-Max |
|
0.79 ns
|
JESD-30 Code |
|
S-PBGA-B1156
|
Length |
|
35 mm
|
Number of CLBs |
|
10000
|
Number of Terminals |
|
1156
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
|
10000 CLBS
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
BGA
|
Package Equivalence Code |
|
BGA1156,34X34,40
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY
|
Seated Height-Max |
|
3.53 mm
|
Supply Voltage-Max |
|
1.05 V
|
Supply Voltage-Min |
|
0.95 V
|
Supply Voltage-Nom |
|
1 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
OTHER
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
35 mm
|
|
|
|
Compare XQ6VLX130T-1FFG1156E with alternatives
Compare XQ6VLX130T-1FFG1156C with alternatives