XQ6VLX130T-1FFG1156E
vs
XQ6VLX130T-1RFG1156I
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| JESD-609 Code |
e1
|
e0
|
| Moisture Sensitivity Level |
4
|
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
2
|
2
|
| Package Description |
|
FBGA-1156
|
| Combinatorial Delay of a CLB-Max |
|
0.79 ns
|
| JESD-30 Code |
|
S-PBGA-B1156
|
| Length |
|
35 mm
|
| Number of CLBs |
|
10000
|
| Number of Inputs |
|
600
|
| Number of Logic Cells |
|
128000
|
| Number of Outputs |
|
600
|
| Number of Terminals |
|
1156
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
10000 CLBS
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA1156,34X34,40
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Seated Height-Max |
|
3.53 mm
|
| Supply Voltage-Max |
|
1.05 V
|
| Supply Voltage-Min |
|
0.95 V
|
| Supply Voltage-Nom |
|
1 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
35 mm
|
|
|
|