XQ6SLX150-2CSG484I
vs
XC6SLX150-3CSG484C
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
667 MHz
|
862 MHz
|
JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B484
|
JESD-609 Code |
e1
|
e1
|
Moisture Sensitivity Level |
3
|
3
|
Number of Inputs |
338
|
330
|
Number of Logic Cells |
147443
|
147443
|
Number of Outputs |
338
|
330
|
Number of Terminals |
484
|
484
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
FBGA
|
Package Equivalence Code |
BGA484,22X22,32
|
BGA484,22X22,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
BGA
|
Package Description |
|
19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484
|
Pin Count |
|
484
|
Combinatorial Delay of a CLB-Max |
|
0.21 ns
|
Length |
|
19 mm
|
Number of CLBs |
|
11519
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
|
11519 CLBS
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
1.8 mm
|
Supply Voltage-Max |
|
1.26 V
|
Supply Voltage-Min |
|
1.14 V
|
Supply Voltage-Nom |
|
1.2 V
|
Temperature Grade |
|
OTHER
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
19 mm
|
|
|
|
Compare XQ6SLX150-2CSG484I with alternatives
Compare XC6SLX150-3CSG484C with alternatives