XQ5VFX100T-1EF1738I
vs
XC5VFX100T-1FF1738I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
XILINX INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
FCBGA-1738
BGA-1738
Pin Count
1738
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
Clock Frequency-Max
1098 MHz
Combinatorial Delay of a CLB-Max
0.9 ns
0.9 ns
JESD-30 Code
S-PBGA-B1738
S-PBGA-B1738
JESD-609 Code
e0
e0
Length
42.5 mm
42.5 mm
Number of CLBs
8960
8000
Number of Inputs
680
680
Number of Logic Cells
102400
102400
Number of Outputs
680
680
Number of Terminals
1738
1738
Operating Temperature-Max
100 °C
100 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1738,42X42,40
BGA1738,42X42,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.25 mm
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
42.5 mm
42.5 mm
Base Number Matches
1
2
Factory Lead Time
12 Weeks
Samacsys Manufacturer
AMD
Moisture Sensitivity Level
4
Organization
8000 CLBS
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
30
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