XQ5VFX100T-1EF1738I vs XC5VFX100T-2FF1738C feature comparison

XQ5VFX100T-1EF1738I AMD Xilinx

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XC5VFX100T-2FF1738C AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FCBGA-1738 BGA-1738
Pin Count 1738 1738
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1098 MHz
Combinatorial Delay of a CLB-Max 0.9 ns 0.77 ns
JESD-30 Code S-PBGA-B1738 S-PBGA-B1738
JESD-609 Code e0 e0
Length 42.5 mm 42.5 mm
Number of CLBs 8960 8000
Number of Inputs 680 680
Number of Logic Cells 102400 102400
Number of Outputs 680 680
Number of Terminals 1738 1738
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1738,42X42,40 BGA1738,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.25 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 42.5 mm 42.5 mm
Base Number Matches 1 2
Moisture Sensitivity Level 4
Organization 8000 CLBS
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30

Compare XQ5VFX100T-1EF1738I with alternatives

Compare XC5VFX100T-2FF1738C with alternatives