XPS63810YFFT
vs
MAX17135ETJ+
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
VFBGA,
|
HVQCCN, LCC32,.2SQ,20
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2019-10-17
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Additional Feature |
1.8 V TO 4.975 V
|
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2.2 V
|
2.7 V
|
| Input Voltage-Nom |
3.6 V
|
3.6 V
|
| JESD-30 Code |
R-PBGA-B15
|
S-XQCC-N32
|
| Length |
2.255 mm
|
5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
15
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
3 A
|
2.1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
VFBGA
|
HVQCCN
|
| Package Equivalence Code |
BGA15,3X5,16
|
LCC32,.2SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
0.625 mm
|
0.8 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK-BOOST
|
BUCK-BOOST
|
| Switching Frequency-Max |
2600 kHz
|
1150 kHz
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
1.344 mm
|
5 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
32
|
| Moisture Sensitivity Level |
|
1
|
| Output Voltage-Nom |
|
1.25 V
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max (Isup) |
|
3.5 mA
|
| Supply Voltage-Nom (Vsup) |
|
3.6 V
|
| Technology |
|
BICMOS
|
| Terminal Finish |
|
NICKEL GOLD PALLADIUM
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare XPS63810YFFT with alternatives
Compare MAX17135ETJ+ with alternatives