XPC850ZT50BU vs MCF54450CVM180 feature comparison

XPC850ZT50BU Freescale Semiconductor

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MCF54450CVM180 Freescale Semiconductor

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, ROHS COMPLIANT, MAPBGA-256
Pin Count 256 256
Reach Compliance Code not_compliant compliant
ECCN Code 5A991 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 26 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 60 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 23 mm 17 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,50 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.35 mm 1.6 mm
Speed 50 MHz 180 MHz
Supply Voltage-Max 3.465 V 1.65 V
Supply Voltage-Min 3.135 V 1.35 V
Supply Voltage-Nom 3.3 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 23 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code Yes
Samacsys Manufacturer NXP
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER OVER NICKEL

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Compare MCF54450CVM180 with alternatives