XPC850SRVR66BU
vs
XPC850DECZT66B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
BGA
Package Description
23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256
BGA, BGA256,16X16,50
Pin Count
256
Reach Compliance Code
unknown
unknown
ECCN Code
5A991
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
26
26
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
23 mm
23 mm
Low Power Mode
YES
YES
Number of Terminals
256
256
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.35 mm
2.35 mm
Speed
66 MHz
66 MHz
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
23 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
3
Rohs Code
JESD-609 Code
e0
Operating Temperature-Max
95 °C
Operating Temperature-Min
-40 °C
Package Equivalence Code
BGA256,16X16,50
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Compare XPC850SRVR66BU with alternatives
Compare XPC850DECZT66B with alternatives