Findchips: Compare XPC850DECZT66B vs XPC850SRCVR66BU

XPC850DECZT66B vs XPC850SRCVR66BU feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	MOTOROLA INC	FREESCALE SEMICONDUCTOR INC
Package Description	BGA, BGA256,16X16,50	23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256
Reach Compliance Code	unknown	unknown
ECCN Code	3A991.A.2	5A991
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	26	26
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	66 MHz	66 MHz
External Data Bus Width	32	32
Format	FIXED POINT	FIXED POINT
Integrated Cache	YES	YES
JESD-30 Code	S-PBGA-B256	S-PBGA-B256
JESD-609 Code	e0
Length	23 mm	23 mm
Low Power Mode	YES	YES
Number of Terminals	256	256
Operating Temperature-Max	95 °C
Operating Temperature-Min	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA256,16X16,50
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.35 mm	2.35 mm
Speed	66 MHz	66 MHz
Supply Voltage-Max	3.465 V	3.465 V
Supply Voltage-Min	3.135 V	3.135 V
Supply Voltage-Nom	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL
Terminal Finish	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	23 mm	23 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	3	1
Part Package Code		BGA
Pin Count		256
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors