XPC850DEZT66B
vs
XPC850SRCZT66B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA INC
Package Description
BGA, BGA256,16X16,50
BGA, BGA256,16X16,50
Reach Compliance Code
unknown
unknown
Bit Size
32
32
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e0
Number of Terminals
256
256
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,50
BGA256,16X16,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Power Supplies
3.3 V
Qualification Status
Not Qualified
Not Qualified
Speed
66 MHz
66 MHz
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
3
Part Package Code
BGA
Pin Count
256
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
26
Boundary Scan
YES
Clock Frequency-Max
66 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
Length
23 mm
Low Power Mode
YES
Operating Temperature-Max
95 °C
Operating Temperature-Min
-40 °C
Seated Height-Max
2.35 mm
Supply Voltage-Max
3.465 V
Supply Voltage-Min
3.135 V
Temperature Grade
INDUSTRIAL
Width
23 mm
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