XPC850SRCZT66B vs XPC850DECVR66BU feature comparison

XPC850SRCZT66B Motorola Semiconductor Products

Buy Now Datasheet

XPC850DECVR66BU Freescale Semiconductor

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Package Description BGA, BGA256,16X16,50 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 5A991
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 26 26
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 23 mm 23 mm
Low Power Mode YES YES
Number of Terminals 256 256
Operating Temperature-Max 95 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.35 mm 2.35 mm
Speed 66 MHz 66 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 1
Part Package Code BGA
Pin Count 256
Samacsys Manufacturer NXP
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

Compare XPC850SRCZT66B with alternatives

Compare XPC850DECVR66BU with alternatives