XPC8260ACZUMIBA
vs
MPC8260ACZUMIBB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Package Description
LBGA,
37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.66 MHz
66.66 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B480
S-PBGA-B480
JESD-609 Code
e0
e0
Length
37.5 mm
37.5 mm
Low Power Mode
NO
NO
Number of Terminals
480
480
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.65 mm
1.65 mm
Speed
266 MHz
266 MHz
Supply Voltage-Max
2.7 V
2.2 V
Supply Voltage-Min
2.4 V
1.9 V
Supply Voltage-Nom
2.5 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
37.5 mm
37.5 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
4
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
220
Time@Peak Reflow Temperature-Max (s)
30
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