XPC8245LZU300B
vs
XPC8245TZU300B
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
MOTOROLA INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LBGA, BGA352,26X26,50
|
LBGA, BGA352,26X26,50
|
Pin Count |
352
|
352
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
ALSO OPERATES AT 2V SUPPLY
|
ALSO OPERATES AT 2V SUPPLY
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66 MHz
|
66 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
JESD-609 Code |
e0
|
e0
|
Length |
35 mm
|
35 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
352
|
352
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA352,26X26,50
|
BGA352,26X26,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
220
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.65 mm
|
1.65 mm
|
Speed |
300 MHz
|
300 MHz
|
Supply Voltage-Max |
1.9 V
|
1.9 V
|
Supply Voltage-Min |
1.7 V
|
1.7 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
35 mm
|
35 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
3
|
4
|
|
|
|
Compare XPC8245LZU300B with alternatives
Compare XPC8245TZU300B with alternatives