XPC8245TZU300B
vs
GXM-180B2.9V70C
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
BGA, BGA352,26X26,50
|
BGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO OPERATES AT 2V SUPPLY
|
ALSO REQUIRES 3.3V SUPPLY
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
| Length |
35 mm
|
35 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
352
|
352
|
| On Chip Data RAM Width |
32
|
|
| Operating Temperature-Max |
105 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA352,26X26,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Seated Height-Max |
1.65 mm
|
2.23 mm
|
| Speed |
300 MHz
|
180 MHz
|
| Supply Voltage-Max |
1.9 V
|
3.05 V
|
| Supply Voltage-Min |
1.7 V
|
2.75 V
|
| Supply Voltage-Nom |
1.8 V
|
2.9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
35 mm
|
35 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
4
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
352
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare GXM-180B2.9V70C with alternatives