XCV2000E-6FG1156C vs XQV2000E-6FG1156N feature comparison

XCV2000E-6FG1156C AMD Xilinx

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XQV2000E-6FG1156N AMD

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer XILINX INC ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description BGA, BGA1156,34X34,40 PLASTIC, FPBGA-1156
Pin Count 1156
Reach Compliance Code not_compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Clock Frequency-Max 357 MHz 357.2 MHz
Combinatorial Delay of a CLB-Max 0.47 ns
JESD-30 Code S-PBGA-B1156 S-PBGA-B1156
JESD-609 Code e0 e0
Length 35 mm 35 mm
Number of CLBs 9600 9600
Number of Equivalent Gates 518400 2541952
Number of Inputs 804 804
Number of Logic Cells 43200 43200
Number of Outputs 804 804
Number of Terminals 1156 1156
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -55 °C
Organization 9600 CLBS, 518400 GATES 9600 CLBS, 2541952 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1156,34X34,40 BGA1156,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 1 2
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Screening Level 38535Q/M;38534H;883B
Time@Peak Reflow Temperature-Max (s) 30

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