XCV2000E-6FG1156C
vs
XQV2000E-6FG1156N
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
BGA
|
|
Package Description |
BGA, BGA1156,34X34,40
|
PLASTIC, FPBGA-1156
|
Pin Count |
1156
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Clock Frequency-Max |
357 MHz
|
357.2 MHz
|
Combinatorial Delay of a CLB-Max |
0.47 ns
|
|
JESD-30 Code |
S-PBGA-B1156
|
S-PBGA-B1156
|
JESD-609 Code |
e0
|
e0
|
Length |
35 mm
|
35 mm
|
Number of CLBs |
9600
|
9600
|
Number of Equivalent Gates |
518400
|
2541952
|
Number of Inputs |
804
|
804
|
Number of Logic Cells |
43200
|
43200
|
Number of Outputs |
804
|
804
|
Number of Terminals |
1156
|
1156
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
9600 CLBS, 518400 GATES
|
9600 CLBS, 2541952 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1156,34X34,40
|
BGA1156,34X34,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.6 mm
|
2.6 mm
|
Supply Voltage-Max |
1.89 V
|
1.89 V
|
Supply Voltage-Min |
1.71 V
|
1.71 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn63Pb37)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
1
|
2
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
225
|
Screening Level |
|
38535Q/M;38534H;883B
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare XCV2000E-6FG1156C with alternatives