XCV2000E-6FG1156C vs XCV2000E-6FGG1156C feature comparison

XCV2000E-6FG1156C AMD Xilinx

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XCV2000E-6FGG1156C AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA1156,34X34,40 BGA, BGA1156,34X34,40
Pin Count 1156 1156
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 357 MHz 357 MHz
Combinatorial Delay of a CLB-Max 0.47 ns 0.47 ns
JESD-30 Code S-PBGA-B1156 S-PBGA-B1156
JESD-609 Code e0 e1
Length 35 mm 35 mm
Number of CLBs 9600 9600
Number of Equivalent Gates 518400 518400
Number of Inputs 804 804
Number of Logic Cells 43200 43200
Number of Outputs 804 804
Number of Terminals 1156 1156
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 9600 CLBS, 518400 GATES 9600 CLBS, 518400 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1156,34X34,40 BGA1156,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 1 1
Moisture Sensitivity Level 3

Compare XCV2000E-6FG1156C with alternatives

Compare XCV2000E-6FGG1156C with alternatives