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XCV2000E-6BGG560I vs XQV2000E-6BG560N feature comparison

XCV2000E-6BGG560I AMD Xilinx

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XQV2000E-6BG560N AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, BGA560,33X33,50 PLASTIC, BGA-560
Pin Count 560 560
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 357 MHz 357.2 MHz
Combinatorial Delay of a CLB-Max 0.47 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e1
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3
Number of CLBs 9600 9600
Number of Equivalent Gates 518400 2541952
Number of Inputs 404 404
Number of Logic Cells 43200 43200
Number of Outputs 404 404
Number of Terminals 560 560
Operating Temperature-Max 100 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 9600 CLBS, 518400 GATES 9600 CLBS, 2541952 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA560,33X33,50 BGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Screening Level 38535Q/M;38534H;883B
Temperature Grade MILITARY
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

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