XQV2000E-6BG560N vs XCV2000E-7BGG560I feature comparison

XQV2000E-6BG560N AMD Xilinx

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XCV2000E-7BGG560I AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-560 LBGA, BGA560,33X33,50
Pin Count 560 560
Reach Compliance Code not_compliant compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 357.2 MHz 400 MHz
JESD-30 Code S-PBGA-B560 S-PBGA-B560
Length 42.5 mm 42.5 mm
Number of CLBs 9600 9600
Number of Equivalent Gates 2541952 518400
Number of Inputs 404 404
Number of Logic Cells 43200 43200
Number of Outputs 404 404
Number of Terminals 560 560
Operating Temperature-Max 125 °C 100 °C
Operating Temperature-Min -55 °C -40 °C
Organization 9600 CLBS, 2541952 GATES 9600 CLBS, 518400 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA560,33X33,50 BGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Pbfree Code Yes
Combinatorial Delay of a CLB-Max 0.42 ns
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Time@Peak Reflow Temperature-Max (s) 30

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