XCV1000E-7FGG900I vs XCV1000E-8FG900C feature comparison

XCV1000E-7FGG900I AMD Xilinx

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XCV1000E-8FG900C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA900,30X30,40 FBGA-900
Pin Count 900 900
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 400 MHz 416 MHz
Combinatorial Delay of a CLB-Max 0.42 ns 0.4 ns
JESD-30 Code S-PBGA-B900 S-PBGA-B900
JESD-609 Code e1 e0
Length 31 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6144 6144
Number of Equivalent Gates 331776 331776
Number of Inputs 660 660
Number of Logic Cells 27648 27648
Number of Outputs 660 660
Number of Terminals 900 900
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 6144 CLBS, 331776 GATES 6144 CLBS, 331776 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA900,30X30,40 BGA900,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 31 mm 31 mm
Base Number Matches 1 1
Temperature Grade OTHER

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