XCV1000E-8FG900C
vs
XCV1000E-7FG900C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
FBGA-900
FBGA-900
Pin Count
900
900
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
416 MHz
400 MHz
Combinatorial Delay of a CLB-Max
0.4 ns
0.42 ns
JESD-30 Code
S-PBGA-B900
S-PBGA-B900
JESD-609 Code
e0
e0
Length
31 mm
31 mm
Moisture Sensitivity Level
3
3
Number of CLBs
6144
6144
Number of Equivalent Gates
331776
331776
Number of Inputs
660
660
Number of Logic Cells
27648
27648
Number of Outputs
660
660
Number of Terminals
900
900
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
6144 CLBS, 331776 GATES
6144 CLBS, 331776 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA900,30X30,40
BGA900,30X30,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.89 V
1.89 V
Supply Voltage-Min
1.71 V
1.71 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
31 mm
31 mm
Base Number Matches
1
1
Compare XCV1000E-8FG900C with alternatives
Compare XCV1000E-7FG900C with alternatives