XCV1000E-6BG560C vs XQV1000-4BGG560N feature comparison

XCV1000E-6BG560C AMD Xilinx

Buy Now Datasheet

XQV1000-4BGG560N AMD Xilinx

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-560 LBGA,
Pin Count 560 560
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 357 MHz
Combinatorial Delay of a CLB-Max 0.47 ns 0.8 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e0 e1
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6144 6144
Number of Equivalent Gates 331776 1124022
Number of Inputs 404
Number of Logic Cells 27648
Number of Outputs 404
Number of Terminals 560 560
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -55 °C
Organization 6144 CLBS, 331776 GATES 6144 CLBS, 1124022 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 1.89 V 2.625 V
Supply Voltage-Min 1.71 V 2.375 V
Supply Voltage-Nom 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER MILITARY
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1

Compare XCV1000E-6BG560C with alternatives

Compare XQV1000-4BGG560N with alternatives