XQV1000-4BGG560N
vs
XCV1000-5BGG560C
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LBGA,
|
LBGA,
|
| Pin Count |
560
|
560
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Combinatorial Delay of a CLB-Max |
0.8 ns
|
0.7 ns
|
| JESD-30 Code |
S-PBGA-B560
|
S-PBGA-B560
|
| JESD-609 Code |
e1
|
e1
|
| Length |
42.5 mm
|
42.5 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
6144
|
6144
|
| Number of Equivalent Gates |
1124022
|
1124022
|
| Number of Terminals |
560
|
560
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
6144 CLBS, 1124022 GATES
|
6144 CLBS, 1124022 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Supply Voltage-Max |
2.625 V
|
2.625 V
|
| Supply Voltage-Min |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
OTHER
|
| Terminal Finish |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
42.5 mm
|
42.5 mm
|
| Base Number Matches |
1
|
1
|
| Clock Frequency-Max |
|
294 MHz
|
|
|
|
Compare XQV1000-4BGG560N with alternatives
Compare XCV1000-5BGG560C with alternatives