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XCV100-5BGG256C vs XQV100-4BG256N feature comparison

XCV100-5BGG256C AMD Xilinx

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XQV100-4BG256N AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, PLASTIC, BGA-256
Pin Count 256 256
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 294 MHz
Combinatorial Delay of a CLB-Max 0.7 ns 0.8 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 600 600
Number of Equivalent Gates 108904 108904
Number of Inputs 180 180
Number of Outputs 180 180
Number of Terminals 256 256
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -55 °C
Organization 600 CLBS, 108904 GATES 600 CLBS, 108904 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,20X20,50 BGA256,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER MILITARY
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Number of Logic Cells 2700
Screening Level MIL-PRF-38535
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

Compare XCV100-5BGG256C with alternatives

Compare XQV100-4BG256N with alternatives