XCR3512XL-10FT256C
vs
LC5512MV-45F256C
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
LATTICE SEMICONDUCTOR CORP
|
Package Description |
FBGA-256
|
FPBGA-256
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
Additional Feature |
YES
|
YES
|
Clock Frequency-Max |
97 MHz
|
|
In-System Programmable |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
e0
|
JTAG BST |
YES
|
YES
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Dedicated Inputs |
|
|
Number of I/O Lines |
212
|
193
|
Number of Inputs |
212
|
|
Number of Macro Cells |
512
|
512
|
Number of Outputs |
212
|
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
|
|
Organization |
0 DEDICATED INPUTS, 212 I/O
|
0 DEDICATED INPUTS, 193 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
BGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Programmable Logic Type |
EE PLD
|
EE PLD
|
Propagation Delay |
10 ns
|
5.7 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.55 mm
|
2.1 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
256
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
|
|
|
Compare LC5512MV-45F256C with alternatives