Programmable Logic Programmable Logic Devices XCR3512XL-10FT256C

XCR3512XL-10FT256C by

Description: EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FBGA-256

Overview of XCR3512XL-10FT256C by AMD

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Show differences only	XCR3512XL-10FT256C AMD Buy Now	part-to-be-compared AMD Buy Now
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Rohs Code	No
Part Life Cycle Code	Obsolete
Ihs Manufacturer	ADVANCED MICRO DEVICES INC
Package Description	FBGA-256
Reach Compliance Code	not_compliant
Additional Feature	YES
Clock Frequency-Max	97 MHz
In-System Programmable	YES
JESD-30 Code	S-PBGA-B256
JESD-609 Code	e0
JTAG BST	YES
Length	17 mm
Moisture Sensitivity Level	3
Number of Dedicated Inputs
Number of I/O Lines	212
Number of Inputs	212
Number of Macro Cells	512
Number of Outputs	212
Number of Terminals	256
Operating Temperature-Max	70 °C
Operating Temperature-Min
Organization	0 DEDICATED INPUTS, 212 I/O
Output Function	MACROCELL
Package Body Material	PLASTIC/EPOXY
Package Code	LBGA
Package Equivalence Code	BGA256,16X16,40
Package Shape	SQUARE
Package Style	GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)	225
Programmable Logic Type	EE PLD
Propagation Delay	10 ns
Qualification Status	Not Qualified
Seated Height-Max	1.55 mm
Supply Voltage-Max	3.6 V
Supply Voltage-Min	3 V
Supply Voltage-Nom	3.3 V
Surface Mount	YES
Technology	CMOS
Temperature Grade	COMMERCIAL
Terminal Finish	TIN LEAD
Terminal Form	BALL
Terminal Pitch	1 mm
Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Width	17 mm

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