XCR3512XL-10FT256C vs XCR3512XL-10FTG256I feature comparison

XCR3512XL-10FT256C AMD Xilinx

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XCR3512XL-10FTG256I AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-256 FBGA-256
Pin Count 256 256
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 12 Weeks 12 Weeks
Additional Feature YES YES
Clock Frequency-Max 97 MHz 97 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
JTAG BST YES YES
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 212 212
Number of Macro Cells 512 512
Number of Terminals 256 256
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 212 I/O 0 DEDICATED INPUTS, 212 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type EE PLD EE PLD
Propagation Delay 10 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 2.7 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 1 1

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Compare XCR3512XL-10FTG256I with alternatives