XCR3256XL-12FTG256I vs LC5256MV-75FN256C feature comparison

XCR3256XL-12FTG256I AMD Xilinx

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LC5256MV-75FN256C Lattice Semiconductor Corporation

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description FBGA-256 LEAD FREE, FPBGA-256
Pin Count 256 256
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 12 Weeks
Additional Feature YES YES
Clock Frequency-Max 88 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
JTAG BST YES YES
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 164 141
Number of Macro Cells 256 256
Number of Terminals 256 256
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 164 I/O 0 DEDICATED INPUTS, 141 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 260 250
Programmable Logic Type EE PLD EE PLD
Propagation Delay 12 ns 9.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 2.1 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 2.7 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 17 mm 17 mm
Base Number Matches 2 1

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Compare LC5256MV-75FN256C with alternatives