XCR3256XL-10FTG256C
vs
CY37256VP256-66BBXI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
XILINX INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
FBGA-256
17 X 17 MM, 1 MM PITCH, FBGA-256
Pin Count
256
256
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
12 Weeks
Additional Feature
YES
256 MACROCELLS
Clock Frequency-Max
105 MHz
50 MHz
In-System Programmable
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e1
JTAG BST
YES
Length
17 mm
17 mm
Moisture Sensitivity Level
3
Number of Dedicated Inputs
1
Number of I/O Lines
164
197
Number of Macro Cells
256
Number of Terminals
256
256
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
0 DEDICATED INPUTS, 164 I/O
1 DEDICATED INPUTS, 197 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
10 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.55 mm
1.6 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
17 mm
17 mm
Base Number Matches
2
1
Compare XCR3256XL-10FTG256C with alternatives
Compare CY37256VP256-66BBXI with alternatives