XCKU15P-L1FFVA1760I vs XCKU15P-1LFFVE1517I feature comparison

XCKU15P-L1FFVA1760I AMD Xilinx

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XCKU15P-1LFFVE1517I AMD Xilinx

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description BGA, BGA1760,42X42,40 ,
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.7.B
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2016-06-03 2018-03-09
JESD-30 Code S-PBGA-B1760
JESD-609 Code e1 e1
Length 42.5 mm
Moisture Sensitivity Level 4 4
Number of CLBs 65340
Number of Inputs 668
Number of Logic Cells 1143450
Number of Outputs 668
Number of Terminals 1760
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 65340 CLBs
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 3.71 mm
Supply Voltage-Max 0.742 V
Supply Voltage-Min 0.698 V
Supply Voltage-Nom 0.72 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

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Compare XCKU15P-1LFFVE1517I with alternatives