XCKU040-3FBVA676I vs XCKU040-3SFVA784I feature comparison

XCKU040-3FBVA676I AMD Xilinx

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XCKU040-3SFVA784I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description FBGA-676 FPBGA-784
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2017-02-15 2017-02-15
JESD-30 Code S-PBGA-B676 S-PBGA-B784
JESD-609 Code e1 e1
Length 27 mm 23 mm
Moisture Sensitivity Level 4
Number of CLBs 30300 30300
Number of Inputs 520 520
Number of Logic Cells 530250 530250
Number of Outputs 520 520
Number of Terminals 676 784
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 30300 CLBS 30300 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA FBGA
Package Equivalence Code BGA676,26X26,40 BGA784,28X28,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.71 mm 3.52 mm
Supply Voltage-Max 1.03 V 1.03 V
Supply Voltage-Min 0.97 V 0.97 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm 23 mm
Base Number Matches 1 1

Compare XCKU040-3FBVA676I with alternatives

Compare XCKU040-3SFVA784I with alternatives