XC95288XL-10BG352C vs XC95288XL-6BGG352C feature comparison

XC95288XL-10BG352C AMD Xilinx

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XC95288XL-6BGG352C AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-352 LBGA,
Pin Count 352 352
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 288 MACROCELLS 288 MACROCELLS
Clock Frequency-Max 100 MHz 151.5 MHz
In-System Programmable YES
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e0 e1
JTAG BST YES
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 192 192
Number of Macro Cells 288
Number of Terminals 352 352
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 0 DEDICATED INPUTS, 192 I/O 0 DEDICATED INPUTS, 192 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 10 ns 6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn63Pb37) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1

Compare XC95288XL-10BG352C with alternatives

Compare XC95288XL-6BGG352C with alternatives