XC7VX550T-3FFG1158I vs XC7VX550T-3FFG1158E feature comparison

XC7VX550T-3FFG1158I AMD Xilinx

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XC7VX550T-3FFG1158E AMD Xilinx

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-609 Code e1 e1
Moisture Sensitivity Level 4 4
Peak Reflow Temperature (Cel) 245 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code BGA
Package Description FBGA-1158
Pin Count 1158
ECCN Code 3A001.A.7.B
Clock Frequency-Max 1818 MHz
Combinatorial Delay of a CLB-Max 0.58 ns
JESD-30 Code S-PBGA-B1158
Length 35 mm
Number of CLBs 43300
Number of Inputs 350
Number of Logic Cells 554240
Number of Outputs 350
Number of Terminals 1158
Operating Temperature-Max 100 °C
Operating Temperature-Min
Organization 43300 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.35 mm
Supply Voltage-Max 1.03 V
Supply Voltage-Min 0.97 V
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm

Compare XC7VX550T-3FFG1158I with alternatives

Compare XC7VX550T-3FFG1158E with alternatives