XC7VX550T-3FFG1158I
vs
XC7VX550T-3FFG1158E
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-609 Code
e1
e1
Moisture Sensitivity Level
4
4
Peak Reflow Temperature (Cel)
245
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
1
1
Pbfree Code
Yes
Part Package Code
BGA
Package Description
FBGA-1158
Pin Count
1158
ECCN Code
3A001.A.7.B
Clock Frequency-Max
1818 MHz
Combinatorial Delay of a CLB-Max
0.58 ns
JESD-30 Code
S-PBGA-B1158
Length
35 mm
Number of CLBs
43300
Number of Inputs
350
Number of Logic Cells
554240
Number of Outputs
350
Number of Terminals
1158
Operating Temperature-Max
100 °C
Operating Temperature-Min
Organization
43300 CLBS
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA1156,34X34,40
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
3.35 mm
Supply Voltage-Max
1.03 V
Supply Voltage-Min
0.97 V
Supply Voltage-Nom
1 V
Surface Mount
YES
Technology
CMOS
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
35 mm
Compare XC7VX550T-3FFG1158I with alternatives
Compare XC7VX550T-3FFG1158E with alternatives