XC7S25-1CSGA225Q
vs
XC7A25T-1CSG325I
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Package Description |
LFBGA, BGA225,15X15,32
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
65 Weeks
|
65 Weeks
|
| Clock Frequency-Max |
1098 MHz
|
1098 MHz
|
| Combinatorial Delay of a CLB-Max |
1.27 ns
|
1.27 ns
|
| JESD-30 Code |
S-PBGA-B225
|
S-PBGA-B325
|
| JESD-609 Code |
e1
|
e1
|
| Length |
13 mm
|
15 mm
|
| Number of CLBs |
1825
|
1825
|
| Number of Inputs |
150
|
150
|
| Number of Logic Cells |
23360
|
23360
|
| Number of Outputs |
150
|
150
|
| Number of Terminals |
225
|
325
|
| Operating Temperature-Max |
125 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
1825 CLBS
|
1825 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA225,15X15,32
|
BGA325,18X18,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
1.4 mm
|
1.5 mm
|
| Supply Voltage-Max |
1.05 V
|
1.05 V
|
| Supply Voltage-Min |
0.95 V
|
0.95 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
13 mm
|
15 mm
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2016-11-15
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
HKMG
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare XC7S25-1CSGA225Q with alternatives
Compare XC7A25T-1CSG325I with alternatives