XC7A25T-1CSG325I
vs
XC7S25-1CSGA324C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
65 Weeks
65 Weeks
Date Of Intro
2016-11-15
2016-11-15
Clock Frequency-Max
1098 MHz
1098 MHz
Combinatorial Delay of a CLB-Max
1.27 ns
1.27 ns
JESD-30 Code
S-PBGA-B325
S-PBGA-B324
JESD-609 Code
e1
e1
Length
15 mm
15 mm
Moisture Sensitivity Level
3
Number of CLBs
1825
1825
Number of Inputs
150
150
Number of Logic Cells
23360
23360
Number of Outputs
150
150
Number of Terminals
325
324
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1825 CLBS
1825 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA325,18X18,32
BGA324,18X18,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.5 mm
1.5 mm
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
HKMG
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
15 mm
15 mm
Base Number Matches
2
2
Package Description
CSBGA-324
Compare XC7A25T-1CSG325I with alternatives
Compare XC7S25-1CSGA324C with alternatives