XC7K70T-1FBG676C
vs
XC7K70T-1FBG484I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
XILINX INC
Reach Compliance Code
compliant
compliant
Factory Lead Time
16 Weeks
65 Weeks
Samacsys Manufacturer
AMD
Clock Frequency-Max
1098 MHz
1098 MHz
Combinatorial Delay of a CLB-Max
0.3 ns
0.74 ns
JESD-30 Code
S-PBGA-B676
S-PBGA-B484
JESD-609 Code
e1
e1
Length
27 mm
23 mm
Moisture Sensitivity Level
4
4
Number of CLBs
5125
5125
Number of Inputs
300
285
Number of Logic Cells
65600
65600
Number of Outputs
300
285
Number of Terminals
676
484
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
5125 CLBS
5125 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA676,26X26,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.54 mm
2.54 mm
Supply Voltage-Max
1.03 V
1.03 V
Supply Voltage-Min
0.97 V
0.97 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
27 mm
23 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
484
ECCN Code
3A991.D
HTS Code
8542.39.00.01
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