XC7K325T-2FFV900I
vs
XC7K325T-2FF900C
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Package Description |
BGA,
|
FBGA-900
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Combinatorial Delay of a CLB-Max |
0.61 ns
|
0.61 ns
|
JESD-30 Code |
S-PBGA-B900
|
S-PBGA-B900
|
JESD-609 Code |
e1
|
e0
|
Length |
31 mm
|
31 mm
|
Number of CLBs |
25475
|
25475
|
Number of Terminals |
900
|
900
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
25475 CLBS
|
25475 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA900,30X30,40
|
BGA900,30X30,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
3.35 mm
|
3.35 mm
|
Supply Voltage-Max |
1.03 V
|
1.03 V
|
Supply Voltage-Min |
0.97 V
|
0.97 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
31 mm
|
31 mm
|
Base Number Matches |
1
|
2
|
Clock Frequency-Max |
|
1818 MHz
|
Number of Inputs |
|
500
|
Number of Logic Cells |
|
326080
|
Number of Outputs |
|
500
|
Qualification Status |
|
Not Qualified
|
Technology |
|
CMOS
|
|
|
|
Compare XC7K325T-2FFV900I with alternatives
Compare XC7K325T-2FF900C with alternatives