XC7K325T-2FB900I vs XC7K325T-2FFG900C feature comparison

XC7K325T-2FB900I AMD Xilinx

Buy Now Datasheet

XC7K325T-2FFG900C AMD Xilinx

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 31 X 31 MM, 1 MM PITCH, FBGA-900
Pin Count 900 900
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1818 MHz 1818 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.61 ns
JESD-30 Code S-PBGA-B900 S-PBGA-B900
JESD-609 Code e0 e1
Length 31 mm 31 mm
Moisture Sensitivity Level 4 4
Number of CLBs 25475 25475
Number of Inputs 500 500
Number of Logic Cells 326080 326080
Number of Outputs 500 500
Number of Terminals 900 900
Organization 25475 CLBS 25475 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA900,30X30,40 BGA900,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 3.35 mm
Supply Voltage-Max 1.03 V 1.03 V
Supply Voltage-Min 0.97 V 0.97 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 31 mm 31 mm
Base Number Matches 2 2
Pbfree Code Yes
Factory Lead Time 65 Weeks
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

Compare XC7K325T-2FB900I with alternatives

Compare XC7K325T-2FFG900C with alternatives