XC7K325T-2FB900I
vs
XC7K325T-2FB900C
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
BGA
|
|
| Package Description |
31 X 31 MM, 1 MM PITCH, FBGA-900
|
FBGA-900
|
| Pin Count |
900
|
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
3A991.D
|
|
| HTS Code |
8542.39.00.01
|
|
| Clock Frequency-Max |
1818 MHz
|
1818 MHz
|
| Combinatorial Delay of a CLB-Max |
0.61 ns
|
0.25 ns
|
| JESD-30 Code |
S-PBGA-B900
|
S-PBGA-B900
|
| JESD-609 Code |
e0
|
e0
|
| Length |
31 mm
|
31 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of CLBs |
25475
|
25475
|
| Number of Inputs |
500
|
500
|
| Number of Logic Cells |
326080
|
326080
|
| Number of Outputs |
500
|
500
|
| Number of Terminals |
900
|
900
|
| Organization |
25475 CLBS
|
25475 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA900,30X30,40
|
BGA900,30X30,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
225
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.54 mm
|
2.54 mm
|
| Supply Voltage-Max |
1.03 V
|
1.03 V
|
| Supply Voltage-Min |
0.97 V
|
0.97 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
31 mm
|
31 mm
|
| Base Number Matches |
2
|
2
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Temperature Grade |
|
OTHER
|
|
|
|
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