XC7A200T-1SB484I vs XC7A200T-1FBV484C feature comparison

XC7A200T-1SB484I AMD Xilinx

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XC7A200T-1FBV484C AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description 19 X 19 MM, 0.80 MM PITCH, FBGA-484 FBGA-484
Pin Count 484
Reach Compliance Code unknown compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks
Combinatorial Delay of a CLB-Max 1.27 ns 1.27 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 19 mm 23 mm
Number of CLBs 16825 16825
Number of Inputs 285 285
Number of Logic Cells 215360
Number of Outputs 285 285
Number of Terminals 484 484
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 16825 CLBS 16825 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA BGA
Package Equivalence Code BGA484,22X22,32 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.44 mm 2.54 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Terminal Finish Tin/Lead (Sn/Pb) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 19 mm 23 mm
Base Number Matches 1 1
Temperature Grade OTHER

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Compare XC7A200T-1FBV484C with alternatives