XC6VLX365T-L1FFG1759C
vs
XC6VLX365T-2FFG1759C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
XILINX INC
Package Description
42.50 X 42.50 MM, LEAD FREE, FBGA-1759
42.50 X 42.50 MM, LEAD FREE, FBGA-1759
Reach Compliance Code
not_compliant
compliant
Clock Frequency-Max
1098 MHz
1286 MHz
Combinatorial Delay of a CLB-Max
5.87 ns
4.29 ns
JESD-30 Code
S-PBGA-B1759
S-PBGA-B1759
JESD-609 Code
e1
e1
Length
42.5 mm
42.5 mm
Moisture Sensitivity Level
4
4
Number of Inputs
720
720
Number of Logic Cells
364032
364032
Number of Outputs
720
720
Number of Terminals
1759
1759
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1759,42X42,40
BGA1759,42X42,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
0.93 V
1.05 V
Supply Voltage-Min
0.87 V
0.95 V
Supply Voltage-Nom
0.9 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
42.5 mm
42.5 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
1759
ECCN Code
3A001.A.7.A
HTS Code
8542.39.00.01
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