Findchips: Compare XC6VLX130T-3FF1156C vs XC6VLX130T-3FFG1156C

XC6VLX130T-3FF1156C vs XC6VLX130T-3FFG1156C feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	XILINX INC	XILINX INC
Part Package Code	BGA
Package Description	FBGA-1156
Pin Count	1156
Reach Compliance Code	not_compliant	compliant
ECCN Code	3A991.D	3A991.D
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	1412 MHz	1412 MHz
JESD-30 Code	S-PBGA-B1156	S-PBGA-B1156
JESD-609 Code	e0	e1
Length	35 mm
Moisture Sensitivity Level	4	4
Number of Inputs	600	600
Number of Logic Cells	128000	128000
Number of Outputs	600	600
Number of Terminals	1156	1156
Operating Temperature-Max	85 °C
Operating Temperature-Min
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA1156,34X34,40	BGA1156,34X34,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	225	245
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.5 mm
Supply Voltage-Max	1.05 V
Supply Voltage-Min	0.95 V
Supply Voltage-Nom	1 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	OTHER
Terminal Finish	TIN LEAD	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Width	35 mm
Base Number Matches	1	1
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays