XC6VLX130T-3FFG1156C
vs
XC6VLX130T-L1FFG1156I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
XILINX INC
ADVANCED MICRO DEVICES INC
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
Clock Frequency-Max
1412 MHz
1098 MHz
JESD-30 Code
S-PBGA-B1156
S-PBGA-B1156
JESD-609 Code
e1
e1
Moisture Sensitivity Level
4
4
Number of Inputs
600
600
Number of Logic Cells
128000
128000
Number of Outputs
600
600
Number of Terminals
1156
1156
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1156,34X34,40
BGA1156,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
2
2
Package Description
35 X 35 MM, LEAD FREE, FBGA-1156
Combinatorial Delay of a CLB-Max
5.87 ns
Length
35 mm
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Seated Height-Max
3.5 mm
Supply Voltage-Max
0.93 V
Supply Voltage-Min
0.87 V
Supply Voltage-Nom
0.9 V
Temperature Grade
INDUSTRIAL
Width
35 mm
Compare XC6VLX130T-3FFG1156C with alternatives