XC6VHX565T-2FFG1924I vs XC6VHX565T-2FF1924E feature comparison

XC6VHX565T-2FFG1924I AMD

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XC6VHX565T-2FF1924E AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Package Description 45 X 45 MM, LEAD FREE, FBGA-1924 FBGA-1924
Reach Compliance Code compliant not_compliant
Clock Frequency-Max 1286 MHz 1286 MHz
Combinatorial Delay of a CLB-Max 0.31 ns
JESD-30 Code S-PBGA-B1924 S-PBGA-B1924
JESD-609 Code e1 e0
Length 45 mm 45 mm
Moisture Sensitivity Level 4 4
Number of Inputs 640 640
Number of Logic Cells 566784 566784
Number of Outputs 640 640
Number of Terminals 1924 1924
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 44280 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1924,44X44,40 BGA1924,44X44,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.85 mm 3.85 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 45 mm 45 mm
Base Number Matches 2 2
Part Package Code BGA
Pin Count 1924
ECCN Code 3A001.A.7.B
HTS Code 8542.39.00.01

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