XC6VHX565T-2FF1924E vs XC6VHX565T-2FF1924C feature comparison

XC6VHX565T-2FF1924E AMD Xilinx

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XC6VHX565T-2FF1924C AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-1924 FBGA-1924
Pin Count 1924 1924
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.B 3A001.A.7.B
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1286 MHz 1286 MHz
JESD-30 Code S-PBGA-B1924 S-PBGA-B1924
JESD-609 Code e0 e0
Length 45 mm 45 mm
Moisture Sensitivity Level 4 4
Number of Inputs 640 640
Number of Logic Cells 566784 566784
Number of Outputs 640 640
Number of Terminals 1924 1924
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1924,44X44,40 BGA1924,44X44,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.85 mm 3.85 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 45 mm 45 mm
Base Number Matches 2 2
Pbfree Code No
Combinatorial Delay of a CLB-Max 4.29 ns
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

Compare XC6VHX565T-2FF1924E with alternatives

Compare XC6VHX565T-2FF1924C with alternatives