Findchips: Compare XC6SLX25T-2FG484C vs XC6SLX25T-2FG484Q

XC6SLX25T-2FG484C vs XC6SLX25T-2FG484Q feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No
Rohs Code	No	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	XILINX INC	XILINX INC
Part Package Code	BGA
Package Description	23 X 23 MM, 1 MM PITCH, FBGA-484
Pin Count	484
Reach Compliance Code	not_compliant	compliant
ECCN Code	3A991.D
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	667 MHz
Combinatorial Delay of a CLB-Max	0.26 ns
JESD-30 Code	S-PBGA-B484
JESD-609 Code	e0	e0
Length	23 mm
Moisture Sensitivity Level	3	3
Number of CLBs	1879
Number of Inputs	250
Number of Logic Cells	24051
Number of Outputs	250
Number of Terminals	484
Operating Temperature-Max	85 °C
Operating Temperature-Min
Organization	1879 CLBS
Package Body Material	PLASTIC/EPOXY
Package Code	BGA
Package Equivalence Code	BGA484,22X22,40
Package Shape	SQUARE
Package Style	GRID ARRAY
Peak Reflow Temperature (Cel)	225
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified
Seated Height-Max	2.6 mm
Supply Voltage-Max	1.26 V
Supply Voltage-Min	1.14 V
Supply Voltage-Nom	1.2 V
Surface Mount	YES
Technology	CMOS
Temperature Grade	OTHER
Terminal Finish	TIN LEAD	TIN LEAD
Terminal Form	BALL
Terminal Pitch	1 mm
Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Width	23 mm
Base Number Matches	1	1
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays