XC6SLX25T-2FG484C
vs
XC6SLX25T-2FG484I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
23 X 23 MM, 1 MM PITCH, FBGA-484
23 X 23 MM, 1 MM PITCH, FBGA-484
Pin Count
484
484
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
667 MHz
667 MHz
Combinatorial Delay of a CLB-Max
0.26 ns
0.26 ns
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e0
e0
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1879
1879
Number of Inputs
250
250
Number of Logic Cells
24051
24051
Number of Outputs
250
250
Number of Terminals
484
484
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
1879 CLBS
1879 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
23 mm
Base Number Matches
2
2
Compare XC6SLX25T-2FG484C with alternatives
Compare XC6SLX25T-2FG484I with alternatives