XC6SLX25-3FGG484C vs XC6SLX25-3FGG484I feature comparison

XC6SLX25-3FGG484C AMD Xilinx

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XC6SLX25-3FGG484I AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484
Pin Count 484 484
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 862 MHz 862 MHz
Combinatorial Delay of a CLB-Max 0.21 ns 0.21 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1879 1879
Number of Inputs 266 266
Number of Logic Cells 24051 24051
Number of Outputs 266 266
Number of Terminals 484 484
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1879 CLBS 1879 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 1 1

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