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XC6SLX25-3FGG484I vs XC6SLX25-2FG484I feature comparison

XC6SLX25-3FGG484I AMD Xilinx

Buy Now Datasheet

XC6SLX25-2FG484I AMD

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer XILINX INC ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484 23 X 23 MM, 1 MM PITCH, FBGA-484
Pin Count 484
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Clock Frequency-Max 862 MHz 667 MHz
Combinatorial Delay of a CLB-Max 0.21 ns 0.26 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1879 1879
Number of Inputs 266 266
Number of Logic Cells 24051 24051
Number of Outputs 266 266
Number of Terminals 484 484
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1879 CLBS 1879 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 2 2
Factory Lead Time 12 Weeks
Samacsys Manufacturer AMD
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

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