XC6SLX16-2FTG256Q
vs
XC6SLX16-2CSG324I
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-609 Code |
e1
|
e1
|
| Moisture Sensitivity Level |
3
|
3
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Package Description |
|
15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324
|
| Pin Count |
|
324
|
| ECCN Code |
|
3A991.D
|
| Clock Frequency-Max |
|
667 MHz
|
| Combinatorial Delay of a CLB-Max |
|
0.26 ns
|
| JESD-30 Code |
|
S-PBGA-B324
|
| Length |
|
15 mm
|
| Number of CLBs |
|
1139
|
| Number of Inputs |
|
232
|
| Number of Logic Cells |
|
14579
|
| Number of Outputs |
|
232
|
| Number of Terminals |
|
324
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
1139 CLBS
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFBGA
|
| Package Equivalence Code |
|
BGA324,18X18,32
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.5 mm
|
| Supply Voltage-Max |
|
1.26 V
|
| Supply Voltage-Min |
|
1.14 V
|
| Supply Voltage-Nom |
|
1.2 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
15 mm
|
|
|
|
Compare XC6SLX16-2FTG256Q with alternatives
Compare XC6SLX16-2CSG324I with alternatives